South Korea's semiconductor assembly technology becomes an international standard
South Korea's semiconductor assembly technology becomes an international standard
NITS, under the Ministry of Trade,
Industry, and Energy, is hosting a five-day meeting for the IEC/TC 91 on
Electronic Assembly Technology Standardization with participation from over 50
experts from nine member countries, including the United States, Germany,
Japan, and China. The meeting is being held at the Ocean Suites Hotel in Jeju
from November 6 to 10.
The ongoing international conference is
discussing South Korea's 'Cavity Substrate Design Technology,' a critical
standard related to downsizing semiconductor packages, which is in its final
approval stage for international standardization.
The proposed international standard
addresses 'Laser Bonding Technology' for joining electronic components and
printed circuit boards.
Laser bonding technology, designed to
reduce warpage and energy loss in substrates, is the focus of a proposed
international standard. Its development will continue with approval required
from over two-thirds of the participating member countries in the relevant
technical committee.
Comments
Post a Comment